Cold lamination technology is an innovative smart card production process that, unlike hot pressing, uses special laminating materials to encapsulate electronic components (e.g., Bluetooth chips, batteries, e-ink screens) within standard smart cards under normal temperature and pressure. This solves the issue of component damage in high-temperature/high-pressure hot pressing, addressing traditional small electronics' drawbacks like poor portability and limited functionality. For example, integrating a Bluetooth chip into an IC card adds anti-loss features while retaining payment functions. The card thickness (0.8–1.8mm) is determined by component height, with flexible PCBs and concentrated, uniform-height component layouts recommended for a flat surface, enabling personalized customization and expanding smart card applications.