The RF Spectrum Analyzer enables fast and accurate RF measurements for RFID and smart-card systems, including carrier frequency, modulation quality, bandwidth, and spurious emissions. It supports performance verification, interference analysis, and compliance testing of readers and tags.
A high-throughput card personalization device that integrates multiple card-personalization functions, including magnetic stripe encoding and reading, contact IC chip programming, contactless IC (RFID) chip reading and writing, as well as color and monochrome card printing. It provides a versatile and efficient solution for comprehensive card personalization operations.
A benchtop heating platform featuring digital temperature control and readout for precise thermal management.Provides a uniform and thermally stable heating environment for samples or RFID components, typically used for thermal curing, accelerated aging evaluations, and adhesive bonding processes that require precise temperature control.
Commonly used to assess the thermal resistance of RFID tag substrates and other polymer components, evaluating their deformation and softening behavior under elevated temperature conditions.
A specialized testing device that simulates electrostatic discharge (ESD) events, used to evaluate the immunity of electronic devices (such as RFID tags and chips) to electrostatic environments and to verify their performance stability under ESD stress.
A tensile testing machine that measures strength and durability by applying a uniaxial load to a specimen until failure—commonly used to evaluate adhesive bonds, interconnects and mechanical parts in RFID tags.
A repetitive key-press testing apparatus capable of performing cyclic actuation tests on keys or buttons, used to verify the durability and service life of keys on cold lamination cards and Bluetooth cards, and to evaluate the reliability and failure rate of the keys under prolonged use.
A corrosive-environment test chamber designed to evaluate the corrosion resistance of materials and coatings, commonly used to assess the salt-spray corrosion performance of metal antennas, housings, and components.
An environmental (climatic) test chamber capable of precisely reproducing controlled temperature and humidity profiles. It is used for reliability testing of RFID cards and tags by subjecting devices to programmed thermal and humidity cycles (ramp/soak), thereby assessing operational stability and service life under extreme climatic conditions such as high temperature and high humidity.
A xenon-arc accelerated weathering chamber that simulates sunlight and cyclic moisture to rapidly evaluate product durability under real-world outdoor conditions such as sun and rain.
We utilize industrial-grade offset presses to produce high-quality graphics on plastic card surfaces, delivering vivid, true-to-life color reproduction and precise image registration. Rigorous quality controls preserve image sharpness and consistency across production runs, ensuring every custom design meets the demanding visual standards of premium card applications.
We employ the automated punching system to produce highly accurate holes in PVC, PET substrates and antenna carrier boards. By ensuring consistent hole locations and dimensions on every card, this process provides precise registration for downstream chip placement, antenna alignment and lamination/converting operations—delivering repeatable quality and process stability for high-volume smart-card production.
Delivers automated, high-speed winding of RFID antenna coils with precision motion control and active tension management. Compatible with multiple coil sizes and substrate types, it guarantees exact turn counts, uniform lay-down and repeatable antenna geometry—enabling robust downstream chip attachment and flaw-free lamination for continuous mass production.
Applies adhesive layers precisely to card substrates and antenna assemblies, supporting PVC, PET, and multiple tape formats. Automated positioning and tape placement ensure flat, offset-free bonding with consistent strength, improving efficiency and ensuring stable, repeatable lamination for downstream processes.
We use chip placement machine to accurately place ICs onto card substrates, precisely aligning each chip with the module’s antenna coil to ensure placement accuracy and consistent electrical performance. The automated process markedly increases throughput and enables high-volume production. As a specialized manufacturer, we rely on precision equipment and strict process controls to maintain quality and deliver reliable RFID smart cards to our customers.
We employ high-precision resistance welders to fuse chip leads to antenna coils, ensuring secure and reliable electrical connections. This stable welding process markedly increases joint strength and product yield while accelerating throughput, guaranteeing consistent card performance in large-scale production.
We use post-bond IC test systems to perform 100% functional testing on welded chips, accurately identifying and replacing any defective ICs to ensure every RFID card operates correctly. This rigorous testing secures consistent product quality and high yield, prevents defective units from leaving our facility, and delivers dependable smart cards to our customers.
We use precision die-cutting machines to convert laminated card sheets or roll stock into finished cards according to predefined tooling. This process tightly controls dimensional tolerances, corner radii and edge finish, ensuring every card shipped meets strict size and quality requirements. With flexible, customized dies, we can rapidly support personalized card designs and respond efficiently to the diverse requirements of customers worldwide.
We use the automated inspection system to perform comprehensive final checks on all finished smart cards, covering both visual quality and functional performance. Printing defects, electrical anomalies and other non-conformities are quickly identified and removed, ensuring that every product shipped meets our quality standards and delivers a highly reliable smart-card solution to our customers.
We employ an automatic shrink-wrapping system to efficiently seal finished smart cards, ensuring consistent, secure packaging that protects each card from damage. This streamlined process boosts packaging throughput and guarantees customers receive products in pristine condition.
The machine integrating precision dispensing, flip-chip placement, thermal bonding, and inline inspection into a single automated workflow. This closed-loop system ensures full process control, end-to-end traceability, and consistent electrical/structural quality, with defect rates reduced by real-time data monitoring. High-throughput automation enables reliable large-volume delivery of production-ready RFID tags.
We utilize the tag converting machine to precisely bond flip-chip inlays to label substrates, then seamlessly cut continuous web into individual RFID labels.With automated registration and flawless lamination, we maintain consistent dimensions and optimal RF performance across every unit. This end-to-end process drives throughput, guarantees uniform quality, and delivers reliable high-volume supply for your RFID needs.
